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News Releases

Chiplet Pioneer Eliyan Achieves First Silicon in Record Time with Implementation in TSMC 5nm Process, Confirms Most Efficient Chiplet Interconnect Solution in the Multi-Die Era

SANTA CLARA, Calif. – May 23, 2023 – Eliyan Corporation, credited for the invention of the semiconductor industry’s highest-performance and most efficient chiplet interconnect, today announced silicon availability for its breakthrough NuLink™ PHY technology. First silicon, ach...

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Chiplet Pioneer Eliyan Names Noted Communications Circuit Expert and IEEE Pederson Award Winner Dr. Behzad Razavi as Chief Technologist

SANTA CLARA, Calif. – April 20, 2023 – Eliyan Corporation, credited for the invention of the semiconductor industry’s highest-performance and most efficient chiplet interconnect, today announced that it has named Dr. Behzad Razavi as its Chief Technologist to help guide the de...

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Chiplet Pioneer Eliyan Joins UCIe and JEDEC Industry Standardization Organizations, Expands Veteran Leadership Team to Accelerate Adoption of Breakthrough Die-to-Die Interconnect Solution

SANTA CLARA, Calif. – January 24, 2023 – Eliyan Corporation, credited for the invention of the semiconductor industry’s highest-performance and most efficient chiplet interconnect, today announced it has joined two key industry standardization efforts, bringing its expertise t...

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